Our Products & Services

We utilize our self-developed coating and lamination equipment to bond films compatible with TFT or semiconductor processes onto rigid substrates such as glass or wafers. This allows the flexible films to be processed using our clients’ existing equipment, enabling further downstream manufacturing.

 GIO has developed and implemented its own proprietary COB die bonding process with mass transfer capabilities. This process enhances flatness and placement uniformity, making it particularly well-suited for high-resolution flexible and rigid displays. 

 MINI LED P0.75 Transparent Display

• Energy Efficient
• High Resolution
• Extended Product Lifespan
• Flexible Design
• System Compatibility
• Market Advantages

 Glass substrates are vital for TFT-LCD manufacturing, affecting yield and performance. GIO Optoelectronics has enhanced its processing capabilities to support various glass substrate sizes for advanced packaging like TGV and FOPLP, meeting industry demands.

Our LED lighting products are custom-designed for rail transit systems, featuring high fire-resistance grade optical diffusers.