TGV, FOPLP, and LCD Glass Substrate Processing
Glass substrates are a critical material in TFT-LCD manufacturing, directly impacting panel yield and performance. With the rise of advanced packaging technologies such as TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging), GIO Optoelectronics has expanded its processing capabilities to accommodate a wider range of glass substrate sizes, meeting the evolving demands of the industry.
GIO Offers the Following Glass Substrate Processing Services:
- LCD Standard Sizes: G3.5 to G4.5
Semiconductor Applications:
- 310 mm*310 mm、510 mm *515 mm 、600 mm * 600 mm 、650 mm * 650 mm
Custom Sizes:
- Min 90 mm *90 mm
Tickness Range:
- 0.4 mm ~ 1.1 mm
Product Applications
The glass substrates provided by GIO are suitable for use in a variety of advanced manufacturing processes, including:
- TGV (Through Glass Via)
- FOPLP (Fan-Out Panel Level Packaging)
- Semiconductor processes
- TFT technologies, including a-Si, LTPS, and IGZO
- Color Filter (CF) processes
- Thickness Range: 0.4 mm to 1.1 mm