TGV, FOPLP, and LCD Glass Substrate Processing

Glass substrates are a critical material in TFT-LCD manufacturing, directly impacting panel yield and performance. With the rise of advanced packaging technologies such as TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging), GIO Optoelectronics has expanded its processing capabilities to accommodate a wider range of glass substrate sizes, meeting the evolving demands of the industry.

GIO Offers the Following Glass Substrate Processing Services:

     LCD Standard Sizes: G3.5 to G4.5

Semiconductor Applications:

     310 mm * 310 mm、510 mm * 515 mm 、

     600 mm * 600 mm 、650 mm * 650 mm

Custom Sizes:

     Min 90 mm *90 mm

Tickness Range:

     0.4 mm ~ 1.1 mm

The glass substrates provided by GIO are suitable for use in a variety of advanced manufacturing processes, including:

1. TGV (Through Glass Via)
2. FOPLP (Fan-Out Panel Level Packaging)
3. Semiconductor processes
4. TFT technologies, including a-Si, LTPS, and IGZO
5. Color Filter (CF) processes
6. Thickness Range: 0.4 mm to 1.1 mm