COB Die Bonding Services
What is the COB Process?
COB (Chip-On-Board) refers to a technique where semiconductor chips are directly mounted and bonded onto a printed circuit board (PCB) without traditional packaging. In this method, the chip is exposed and electrically connected directly to the board.
Advantages:
- High Placement Precision: COB die bonding offers superior accuracy, which is especially beneficial for mid- to long-term chip development needs.
- Lower Material Costs: Compared to traditional SMD packaging, COB reduces the need for additional packaging materials, leading to cost savings.
- Advanced Mass Transfer Capability: GIO has developed and implemented its own proprietary COB die bonding process with mass transfer capabilities. This process enhances flatness and placement uniformity, making it particularly well-suited for high-resolution flexible and rigid displays.
- Time Efficiency: Our optimized bonding process significantly shortens the overall die bonding cycle, improving production throughput.
Manufacturing Process
Product Applications
- Mini / Micro LED COB Display / Backlight Unit
Utilized in next-generation display technologies, our COB process supports high-resolution, compact Mini and Micro LED modules, ideal for both display panels and backlight units with exceptional brightness and energy efficiency.
- COB Antenna
Our COB die bonding technology is also applied to high-frequency antenna modules, enabling compact design, stable signal transmission, and precise chip placement for optimal RF performance.
- PILED Transparent Display
By integrating advanced PI-based flexible substrates with LED modules, we offer transparent display solutions suitable for retail, exhibitions, and smart environments. These displays provide high visibility, lightweight form factors, and modern aesthetic appeal.
