Flexible Substrate Lamination
Flexible substrate lamination is designed to produce flexible and bendable products.
We utilize our self-developed coating and lamination equipment to bond films compatible with TFT or semiconductor processes onto rigid substrates such as glass or wafers. This allows the flexible films to be processed using our clients’ existing equipment, enabling further downstream manufacturing.
PITAT ( PI Temporary Attach Technique )
Product Applications
The PITAT PI film we use has physical properties, including a coefficient of thermal expansion (CTE), closely matching that of TFT glass substrates. It can withstand temperatures exceeding 500°C, making it suitable for both standard TFT processes and high-temperature LTPS processes.
Current applications in the TFT field mainly focus on flexible products such as e-paper and X-ray sensors. For LTPS processes, the main applications are in MiniLED and MicroLED display technologies.
We support a wide range of substrate sizes for lamination and can accommodate various customer requirements. Additionally, the films can be provided as pure films or with adhesive layers, depending on specific production needs.
Finger Sensor
Flexible Display (MiniLED/μLED)
X-ray sensor (Flexible)
X-ray sensor (Flexible)
