SMT Contract Manufacturing
Support for General-Purpose Mounting and Multi-Module Configuration – Flexible for Diverse Products
Our SMT production line utilizes high-performance Panasonic pick and place machines, known for their versatility, high speed, high precision, and modular design. This enables flexible adaptation to a wide range of product requirements. The equipment supports component placement from 0201 (imperial) to large-sized components on 50x50 mm ~510x460mm substrate, making it ideal for flexible applications in low-volume, high-mix product development.
Integrated Advantage of COB All-in-One Manufacturing Process
- Single point of contact, reducing customer coordination costs.
- Seamless integration of SMT + COB processes, shortening lead times.
Product Applications
In addition to traditional SMT services, we integrate advanced COB (Chip On Board) technology to offer a full-service manufacturing solution—from material receiving, SMT pick and place, dispensing, COB die bonding, testing, to final packaging. COB technology significantly reduces product size, enhances thermal performance, and lowers costs. It is especially suitable for high-density, high-precision electronic products such as LED modules, sensors, medical devices, and automotive electronics.
We are committed to delivering high-efficiency, high-quality electronic manufacturing services that help our clients accelerate product development and strengthen their market competitiveness.